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This paper presents a zero-level packaging technology for hermetic encapsulation of MEMS. The technology relies on the “chip capping” of the MEMS using a metallic bond made by means of diffusion soldering of a Cu-Sn system at a temperature of around 250°C. For this, on a “capping wafer” a sealing ring (or bond frame), composed of a double layer of Cu/Sn, is grown, and on the MEMS wafer a matching...