Serwis Infona wykorzystuje pliki cookies (ciasteczka). Są to wartości tekstowe, zapamiętywane przez przeglądarkę na urządzeniu użytkownika. Nasz serwis ma dostęp do tych wartości oraz wykorzystuje je do zapamiętania danych dotyczących użytkownika, takich jak np. ustawienia (typu widok ekranu, wybór języka interfejsu), zapamiętanie zalogowania. Korzystanie z serwisu Infona oznacza zgodę na zapis informacji i ich wykorzystanie dla celów korzytania z serwisu. Więcej informacji można znaleźć w Polityce prywatności oraz Regulaminie serwisu. Zamknięcie tego okienka potwierdza zapoznanie się z informacją o plikach cookies, akceptację polityki prywatności i regulaminu oraz sposobu wykorzystywania plików cookies w serwisie. Możesz zmienić ustawienia obsługi cookies w swojej przeglądarce.
Electromagnetic isolation is a critical issue to the performance of radio frequency system in package (RF SIP). This paper proposes a novel structure to measure the electromagnetic (EM) isolation property and to test the shield efficiency of a metal cap. The 3-dimensional structure contains 5 antenna chips assembled is based on rigid and flexible substrates. EM interference and EM isolation relevance...
Passive devices are widely used in all kinds of systems. Generally, most of the passive components in an electronic system are assembled as discrete components or passive arrays. Bu t a discrete passive component occupies a lot of space for the realization of its function. To overcome this shortcoming, one promising way is the integration of passive components into system in package. In this paper,...
Glass is an ideal material for 2.5D packaging application with excellent electrical, optical and mechanical properties. In this paper, several forms of coplanar waveguide (CPW) on glass substrate were modeled and simulated using 3D full-wave finite element method (FEM). The target of this research was to provide guidance for the design and analysis of CPW on glass substrate. Analyses of CPWs on different...
Electromagnetic isolation is a critical issue to the performance of radio frequency system in package (RF SIP). This paper proposes a novel structure to measure the electromagnetic (EM) isolation property and to test the shield efficiency of a metal cap. The 3-dimensional structure contains 5 antenna chips assembled is based on rigid and flexible substrates. EM interference and EM isolation relevance...
Passive devices are widely used in all kinds of systems. Generally, most of the passive components in an electronic system are assembled as discrete components or passive arrays. Bu t a discrete passive component occupies a lot of space for the realization of its function. To overcome this shortcoming, one promising way is the integration of passive components into system in package. In this paper,...
Glass is an ideal material for 2.5D packaging application with excellent electrical, optical and mechanical properties. In this paper, several forms of coplanar waveguide (CPW) on glass substrate were modeled and simulated using 3D full-wave finite element method (FEM). The target of this research was to provide guidance for the design and analysis of CPW on glass substrate. Analyses of CPWs on different...
In this paper, a new high performance three dimensional radio frequency package on package (3D RF PoP) based on ceramic substrate is designed for micro base station which is able to cover the multicasting of critical messages to as many mobile users as possible even under communications network failure events, such as the failure of macro base stations. The RF PoP integrates receiver (RX) module,...
TSV (Through Silicon Via) is regarded as the key enabling technology for 2.5D and 3D IC packaging solution. Si interposers with TSV have emerged as an excellent solution providing high wiring density interconnection, minimizing CTE mismatch to the Cu/low-k chip that is vulnerable to thermo-mechanical stresses, improving electrical performance and decreasing power consumption due to shorter interconnection...
Just in few years, three-dimensional (3D) packaging technologies have attracted much more attention. With emergence of through-silicon via (TSV) technology, silicon-based device integrations, the TSV's, have become the main stream of 3D packaging technologies. TSV's can be further classified as 2.5D and 3D TSV's. For 2.5D TSV package assembly, since multiple components involved, there are normally...
Due to the increasing functional demand and miniaturization in high-density microelectronics packaging, thermomigration in flip chip solder joints owing to Joule heating becomes a serious reliability issue. In recent years, a series of researches have been devoted to examining the failure mechanism of thermomigration in eutectic SnPb and lead-free solder joints. However, only a few studies were focused...
Podaj zakres dat dla filtrowania wyświetlonych wyników. Możesz podać datę początkową, końcową lub obie daty. Daty możesz wpisać ręcznie lub wybrać za pomocą kalendarza.