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In this paper, the impact of process/technology co-optimization on System-on-Chip (SoC) performance using detailed 3-D process/device simulations has been studied for nanoscale FinFET devices. We investigated challenges in FinFET device optimization and scaling while using standard ion implantation process for both overlap and underlap designs. Moreover, an implant-free (IF) complementary metal-oxide-semiconductor...
For the first time this paper makes an attempt at predicting the System-on-Chip (SoC) performance (i.e. logic, SRAM, ESD and I/O) of various sub 20 nm channel length planar and non-planar SOI devices using extensive & well calibrated 3D device and mixed-mode TCAD simulations. It has been shown that the non-planar devices such as FinFETs are not the ideal choice for SoC applications and perform...
We are facing the task to provide ESD protection concepts for complex system on chip (SoC) solutions including RF components, high voltage circuits and mixed signal functionality. Critical issues like protection of sensitive interfaces between supply domains, ESD master bus, system level ESD/EOS requirements and test methodology, are reviewed. Concepts are presented for a SoC and a system-in-package...
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