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Due to the extreme complexity of neuroscience and neurosurgery, there is naturally a need for probing systems with more functions which can probe in three dimensions. For instance, nerves can size differently in different locations and can present three dimensional neuro imaging with multiple recording and stimulating points, calling for the new developments in this emerging field. It is also highly...
Multi-physics multi-scale modeling issues in various stages of the LED manufacturing, 3D-SiP, and nano interconnects have been discussed. Molecular dynamics (MD) and finite element method (FEM) have been used to study the scale effect of the material properties and the prediction of the module behaviors which are critical to LED fabrication. We propose a new concept to integrate multi-physics/multi-scale...
A multi-physics multi-scale modeling platform has been developed and it has been applied to various stages of the LED manufacturing such as MOCVD reactor design, epitaxial growth based on silicon wafer, chip design and manufacturing, module packaging and assembly, and specific lamps. Discussions are also given to the ultra-scalable reactor design, material constitutive modeling, and curvature evolution...
This paper reports on a new package of thermal mass flow meter. The new package is to etch a flow channel on the Al2O3 substrate, and bond the chip to the substrate using flip chip technology. The fluid flows along with the channel and across the sensor element which is made by platinum and this material's resistance changes with the temperature. When fluid flows, there will be a DeltaT between upstream...
Advancement in high heat thermal management technology and its successful integration into emerging GaN-based amplifiers is imperative to meet the long-term requirement of future X-band radar systems. It is also known that the efficiency and reliability of light emitting diode (LED) strongly rely on successful thermal management due to its inherit low junction temperature in the LED chip. In this...
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