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Plasma-enhanced chemical vapor deposited (PECVD) silicon oxide (SiO x ) thin films have been widely used in Micro/Nano Electro Mechanical Systems to form electrical and mechanical components. In this paper, we explore the use of nanoindentation techniques as a method of measuring equivalent stress–strain curves of the PECVD SiO x thin films. Four indenter tips with different geometries...
The time-dependent plastic properties of both as-deposited and annealed plasma-enhanced chemical vapor deposited (PECVD) silicon oxide (SiO x ) thin films were probed by nanoindentation creep tests at room temperature. Our experiments found a strong size effect in the creep responses of the as-deposited PECVD SiO x thin films, which was much reduced after annealing. Based on the experimental...
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