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Warpage is a critical issue for an electronic package molding process. Much work is done in the past to predict the warpage of a package after the cooling down from the molding process. However, there are many material models for the molding compound to predict warpage: Elastic and viscoelastic models are used, and there are even groups which use cure-dependent viscoelastic models. In this paper,...
One type of polymer EPN1180 is selected for the hygroscopic swelling tests and the sample is made in the thickness of 30mum . Coefficient of thermal expansion is tested by using DMA Q800 and coefficient of moisture expansion is tested by using DMA Q800 jointed with a humidity generator. Three conditions temperature, 50degC, 60degC, and 70degC, and different relative humidity with 20RH% steps are used...
Package warpage, interface delamination and thermal fatigue are the major reliability concerns for micro-electronic packages, caused by mismatch in thermal expansion together with residual stress originating from the curing process of the packaging polymers. To investigate the influence of the residual stress- and strain fields on the failure predictions and to optimise the product for reliability,...
Passivation cracking is one of the main failures of ICs and thermo-mechanical failures are the root cause. A major cause for these failures is due to the different coefficients of thermal expansion (CTE), different Young's modulus, Poisson's ratios of package materials under different temperatures and some mechanical loadings. Therefore the working conditions of compound materials used here is expected...
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