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Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on...
Plastic encapsulations will absorb moisture in humid environments due to their hydrophilic nature, this in combination with the inherent ionic contamination of the plastic will result in an electrolyte. This electrolyte might pose several reliability issues for the package and the encapsulated microelectronic circuit, such as electrochemical migration and bond pad corrosion. The corresponding failure...
Despite extensive research over the past decades, corrosion of aluminum bond pads is still a major reliability risk for plastic encapsulated microelectronics. Nowadays even an increase in susceptibility for corrosion is observed for new waferfab technologies and encapsulation materials during reliability tests. The recent trend for the new generation encapsulation materials is to decrease the glass...
Nowadays highly filled epoxy molding compounds are used as material for encapsulation of microelectronic devices. These molding compounds always contain a very low concentration of ionic impurity. In addition ionic species can originate from chemical processes inside the encapsulation. In the presence of an electrical field ions will migrate through the encapsulation, which might eventually result...
The supply current of plastic encapsulated microelectronic devices in the presence of a high potential source can increase abnormally due to parasitic gate leakage. According to reliability qualification standards, stress during a parasitic gate leakage test is applied by a corona discharge at a thin tungsten needle placed a few centimeters above the devices under test. The gate leakage sensitivity...
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