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Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on...
Warpage of micro-electronics caused by the curing process and thermal cycling is of major importance in electronic packaging. Industry is availed by good methods to be able to predict warpage accurately. The main difficulty for prediction of warpage is caused by the complicated material behavior of molding compound. It turns out that the mechanical behavior of molding compound is dependent on time,...
Packaging failures has always been the bottleneck of the development on the new techniques of IC packaging using molding compounds. Numerous simulations are developed to minimize the maximum stress during or after the packaging process. Within those simulations, a reliable kinetic model is indispensable since the viscoelastic properties are related strongly with conversion during the cure process...
In previous work a cure, temperature and time (history) dependent model was developed for the thermal mechanical description of viscoelastic behaviour of moulding compounds during cure. However, so far experimental characterization of the model parameters was restricted to slowly curing compounds that had to be fabricated on laboratory scale. Commercially available moulding compounds generally cure...
In the electronic industry thermoset polymers are used as moulding compounds, underfill materials coatings and adhesives. A good knowledge of the cure shrinkage and material properties is needed to do reliable predictions of the stresses induced during packaging. In this paper, a novel technique using a new PVT (pressure-volume-temperature) apparatus is applied for measuring these quantities. The...
Package warpage, interface delamination and thermal fatigue are the major reliability concerns for micro-electronic packages, caused by mismatch in thermal expansion together with residual stress originating from the curing process of the packaging polymers. To investigate the influence of the residual stress- and strain fields on the failure predictions and to optimise the product for reliability,...
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