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This paper presents the study on the effect of low k stacked layer, chip pad design structures, and shift pad design TM of a large die size Cu/low kappa (BDtrade) chip for improving assembly and reliability performance on organic buildup substrate FCBGA (FlipChip ball grid array). Bump shear characterization has been performed on the integrity of different stacked layer and pad structure, supported...
A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of...
A wafer level packaging technique has been developed with an inherent advantage of excellent solder joint co-planarity essential for wafer level test and burn-in. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced by stretching the solder joint to achieve high aspect ratio and small...
A cost-effective wafer level packaging technique termed "stretch and break", based on stretching and detachment of solder interconnections, has been established. Excellent co-planarity, essential for wafer level test and burn-in, is inherent in the process. The technique allows the freedom to use solder materials of up to 400degC melting temperature for forming the interconnection. The shape...
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