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In tins paper, the effect of a new type of pad structure in which the copper pad is half etched with OSP surface finish on board level thermal cycle reliability of BGA is evaluated comparing conventional flat pad with ENIG surface finish. The test data is presented, including resulting Weibull analyses indicating characteristic life. The solder joint with flat pad Ni/Au surface finish has a little...
With the increasing requirement of thinner, higher density and multi-function product, MCP (multi chip package) is becoming a more and more popular package. And for application in handheld systems, the package's resistance to drop impact becomes especially important. This study uses a simple DAQ system for the drop test according to JEDEC standard, discusses the effects of substrate pad denting, solder...
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