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In this report, a metal-semiconductor-metal varactor diodes on top of an AlGaN/GaN-based epitaxial structure is proposed to the fast surge protection application. The fabricated device's capacitance-voltage (C-V) property and surge immunity are presented. In addition, to verify its capability for slow and fast surge absorption, three protection configurations; the gas discharge arrestor (GDA) only,...
The two bonds important in BCB bonding are discussed. According to the principles of silicon oxide bonding and the nature of these two bonds, we established the most likely mechanism for BCB to oxide bonding. We compare BCB to PECVD oxide bonding with BCB to thermal oxide bonding and investigate the difference in bonding strength. We also observe the BCB surface changes before and after bonding.
The traditional glass drilling using mechanical processing and laser processing in air would produce many kinds of defects such as bugle, debris, crack and scorch. In this paper, we have applied the method of liquid-assisted laser processing (LALP) to reduce the temperature gradient, heat-affect zone region for achieving crack-free glass drilling. At the parameters of laser power 6 W, scanning speed...
The traditional glass forming using laser ablation in air would produce many kinds of defects such as bulge, debris, crack and scorch. In this paper, we have applied the method of PDMS assisted laser processing to reduce the temperature gradient, heat-affect zone region for achieving crack-free glass ablation. The laser power of 15 W, PDMS thickness of 150 μm and scanning speed of 228 and 342 mm/s...
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