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Abstract Through encapsulant vias (TEVs) are an interconnect technology which enables 3D stacking and double sided re-routing of packages encapsulated with epoxy molding compound. These interconnects are formed by Cu-plated holes through the encapsulant and can typically be routed by an RDL (redistribution layer). In order to enable prolonged function of these interconnects, thermomechanical reliability...
Matrix converters (MC) are compact voltage source converters capable of providing variable voltage and variable frequency at the output. Compared with traditional topologies the MC does not require an intermediate DC link and provides sinusoidal output waveform with minimum higher order harmonics. To yield higher rms O/P voltage, it is proposed to use space vector modulation (SVM) algorithm for the...
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