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We have investigated the transient thermal behavior and heat distribution in a multi-quantum wells (MQWs) InGaN/GaN lasers diode for λ~445 nm based on GaN substrate. 2D thermal modeling was performed to estimate the dissipation of heat from the active region. Different thermal designs for planner and solder ball bumps packages have been studied using Al2O3, ceramic-AlN and SiC as submount...
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