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The reliability of discrete power semiconductor packages is getting more and more important in regard to the increasing number of power applications in the low power range. Therefore it is necessary to get more information and details on reliability of discrete packages and systems by performing reliability tests as well as simulations. In this paper the chosen approach and first results of simulations...
The submodel technique was mainly developed in mechanical engineering for complex parts and assemblies. In the simulations of microelectronics housing the technique was successful implemented for thermal cycling conditions. In thispaper the evaluation of the submodel technique for power electronic packages under power cycling conditions will be discussed.
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