Search results for: Daniel Kiener

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article

Editorial for the Special Issue on the Occasion of Reinhard Pippan's 70th Birthday: Celebrating a Legacy of Innovation and Excellence in Material Science

Daniel Kiener, Anton Hohenwarter

Advanced Engineering Materials > 26 > 19 > n/a - n/a

Innovation and Excellence in Material ScienceThe cover photograph shows a collection of tools and samples that were essential during the career of Reinhard Pippan, involving differently sized HPT anvils, various fracture and fatigue specimens, an early dedicated in‐situ testing device, and a broken ski pole of the jubilee ready for applied fracture research. More details can be found in the Guest...

article

Editorial for the Special Issue on the Occasion of Reinhard Pippan's 70th Birthday: Celebrating a Legacy of Innovation and Excellence in Material Science

Daniel Kiener, Anton Hohenwarter

Advanced Engineering Materials > 26 > 19 > n/a - n/a

article

Exploring Refinement Characteristics in FeTi–Cu_x Composites: A Study of Localization and Abrasion Constraints

Lukas Schweiger, Florian Spieckermann, Nadine Buchebner, Julius F. Keckes, more

Advanced Engineering Materials > 26 > 19 > n/a - n/a

FeTi–Cu composites with varying Cu contents are subjected to high‐pressure torsion, and their deformation behavior is explored systematically using scanning electron microscopy, microhardness, and nanoindentation. The study identifies the limiting factors influencing the refinement during severe plastic deformation. The pronounced strength differences between phases lead to fragmentation primarily...

article

High‐Throughput Micromechanical Testing Enabled by Optimized Direct Laser Writing

Alexander Jelinek, Stanislav Zak, Markus Alfreider, Daniel Kiener

Advanced Engineering Materials > 25 > 7 > n/a - n/a

The cover shows a photomontage of 3D‐prints via two‐photon‐lithography. To the lower left, a model of an iconic building of Leoben is shown (base width: 1.1 mm). In the background and inset, optimized push‐to‐pull geometries incorporating double edge‐notched tension specimens (base width: 50 μm) for miniaturized fracture experiments are depicted. Details on are outlined by Alexander Jelinek and co‐workers...

article

High‐Throughput Micromechanical Testing Enabled by Optimized Direct Laser Writing

Alexander Jelinek, Stanislav Zak, Markus Alfreider, Daniel Kiener

Advanced Engineering Materials > 25 > 7 > n/a - n/a

Direct laser writing by two‐photon lithography enables the manufacturing of tailored 3D objects, commonly referred to as 3D‐printing, with submicrometer precision. Thereby, new approaches are enabled for miniaturized optical and mechanical devices, where basic material properties act as design guideline and initial input for finite element simulation‐driven device design. These mechanical properties...

article

Novel Approach for Assessing Cyclic Thermomechanical Behavior of Multilayered Structures

Benjamin Seligmann, Markus Alfreider, Michael Wurmshuber, Daniel Kiener

Advanced Engineering Materials > 25 > 3 > n/a - n/a

Microelectronic devices require material systems combining multiple layers of material for proper operation. These inevitably have different properties, for example, the elastic modulus or the coefficient of thermal expansion. Permanently reoccurring Joule heating and successive cooling during the operation of such devices lead to high thermal stresses within the materials and even failure due to...

article

Understanding the effect of surface flaws on the strength distribution of brittle single crystals

Manuel Gruber, Alexander Leitner, Irina Kraleva, Daniel Kiener, more

Journal of the American Ceramic Society > 101 > 12 > 5705 - 5716

The dependence of strength on the surface quality of brittle single crystals is highly relevant in microelectronic applications, where a certain roughening of the crystal surface is required to guarantee or enhance the functional properties of the final component. In this work, the effect of surface conditioning on the strength distribution of single crystals is assessed on LiTaO₃ and LiNbO₃ samples...

article

In-situ TEM observation of {101¯2} twin-dominated deformation of Mg pillars: Twinning mechanism, size effects and rate dependency

Jiwon Jeong, Markus Alfreider, Ruth Konetschnik, Daniel Kiener, more

Acta Materialia > 2018 > 158 > C > 407-421

To investigate the mechanism of {101¯2} twinning in magnesium (Mg) single crystal and its influence on mechanical size effects and strain rate dependent deformation behavior, in-situ microcompression of Mg [21¯1¯0] pillars of various sizes from 0.5 μm to 4 μm was carried out in a scanning electron microscope (SEM) and also in a transmission electron microscope (TEM), covering strain rates from 10⁻⁴...

article

The use of femtosecond laser ablation as a novel tool for rapid micro-mechanical sample preparation

Manuel J. Pfeifenberger, Melanie Mangang, Stefan Wurster, Jens Reiser, more

Materials & Design > 2017 > 121 > C > 109-118

The focused ion beam technique has become a standard tool for micro-mechanical sample preparation in the last decade due to its high precision and general applicability in material removal. Besides disadvantages such as possible ion damage and high operation costs especially the characteristically small removal rates represent a bottleneck for this application. In contrast, femtosecond lasers provide...

article

Extraction of Flow Behavior and Hall–Petch Parameters Using a Nanoindentation Multiple Sharp Tip Approach

Alexander Leitner, Verena Maier‐Kiener, Daniel Kiener

Advanced Engineering Materials > 19 > 4 > n/a - n/a

An appealing idea to material scientists is to characterize the mechanical behavior of materials with minimal experimental effort while guaranteeing highly reliable results. Nanoindentation is a candidate technique to reach this objective. Though it is already a standard method to extract hardness and Young's modulus, the technique is not yet fully exploited. The authors demonstrate on the example...

article

Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating

Stefan Wurster, Stephan Bigl, Megan J. Cordill, Daniel Kiener

Microelectronic Engineering > 2017 > 167 > C > 110-118

Fatigue is an important reliability issue for microelectronics. In this work, a technique for fast thermal cycling of thin films on substrates is introduced using an infrared laser beam. The advantages of this method are the significantly increased heating and cooling rates compared to conventional slow furnace processes, and the use of readily available small pieces of metallized wafers, which avoid...

article

Correlative microstructure and topography informed nanoindentation of copper films

Stephan Bigl, Thomas Schöberl, Stefan Wurster, Megan J. Cordill, more

Surface and Coatings Technology > 2016 > 308 > C > 404-413

The effect of residual inorganic elements on the local plastic deformation behaviour of two different copper films was investigated. It was found that a film containing inorganic elements in the ppm range, has a distinctively higher hardness at twin boundaries and high angle grain boundaries compared to the grain interior. An almost pure copper film shows no distinct difference regarding the plastic...

article

Ductilisation of tungsten (W) through cold-rolling: R-curve behaviour

Jens Reiser, Stefan Wurster, Jan Hoffmann, Simon Bonk, more

International Journal of Refractory Metals and Hard Materials > 2016 > 58 > C > 22-33

Here we show that cold-rolling of tungsten (W) decreases the stable crack growth onset temperature. Furthermore, we show that stable crack growth is accompanied by crack bridging, which in turn is triggered by dislocation activity. The entire stable crack growth regime shows ductile intergranular fracture.Our ductilisation approach is the modification of microstructure through cold-rolling. In this...

article

Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

Stephan Bigl, Stefan Wurster, Megan J. Cordill, Daniel Kiener

Thin Solid Films > 2016 > 612 > C > 153-164

In this study, two different electrodeposited 5μm thick copper films were subjected to thermal cycling. The microstructural evolution of both films was studied with a site specific tracking technique. It was observed that the initially similar microstructures develop differently upon cycling with respect to grain size and texture. In detail, a Cu film which contains residual inorganic species from...

article

FIB-induced dislocations in Al submicron pillars: Annihilation by thermal annealing and effects on deformation behavior

Subin Lee, Jiwon Jeong, Youbin Kim, Seung Min Han, more

Acta Materialia > 2016 > 110 > C > 283-294

In-situ transmission electron microscopy (TEM) annealing of submicron Al pillars (∼300–450 nm in diameter) fabricated by focused ion beam (FIB) shows that the dislocation loops formed by the high energy Ga⁺ ion beam impact near the material surface can be removed by annealing at around half of the melting point (T_m). Quantitative analysis of real-time TEM data reveals that the dislocation loops first...

chapter

Fracture and material behavior of thin film composites

Darjan Kozic, Ruth Treml, Verena Maier-Kiener, Ronald Schongrundner, more

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) > 1 - 6

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Nanoscale, multi-material thin film structures are commonly used in the design of microelectronic devices. Composites like these have the advantage of occupying a small volume in a specific device which makes a realization of 3D integrated circuits easier. Nonetheless, an arbitrarily fabricated thin film component will not automatically meet the requirements concerning its reliability and persistent...

article

Thermally activated deformation processes in body-centered cubic Cr – How microstructure influences strain-rate sensitivity

Verena Maier, Anton Hohenwarter, Reinhard Pippan, Daniel Kiener

Scripta Materialia > 2015 > 106 > C > 42-45

The microstructure dependent deformation behavior of chromium, especially in terms of strain-rate sensitivity (SRS), was studied by means of improved nanoindentation methods as a function of temperature. Cr was investigated in the single crystalline (sx) and ultrafine-grained (ufg) condition. With increasing temperature a decreasing SRS was determined for sx-Cr, while for ufg-Cr a significant increase...

article

Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary

Peter J. Imrich, Christoph Kirchlechner, Daniel Kiener, Gerhard Dehm

Scripta Materialia > 2015 > 100 > C > 94-97

Uniaxial compression experiments on single- and twinned bicrystalline Cu samples using conventional and scanning in situ transmission electron microscopy reveal no increase in flow stress for the bicrystals. Dislocation curvature and dislocation source size analysis combined with indenter force measurements show agreement between local internal stresses acting on the dislocations and external stresses...

chapter

Fracture mechanics of thin film systems on the sub-micron scale

Darjan Kozic, Ruth Treml, Ronald Schongrundner, Roland Brunner, more

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems > 1 - 5

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Novel design of microelectronic components creates new issues concerning their reliability. Internal mechanical loading, e.g. from residual stresses, or external loading when the component is assembled into a microelectronic device, can cause failure via cracking or delamination. In this work, finite element simulations of micro-beam bending experiments for testing the fracture behavior of thin film...

article

Elevated temperature mechanical properties of novel ultra-fine grained Cu–Nb composites

Mladen-Mateo Primorac, Manuel David Abad, Peter Hosemann, Marius Kreuzeder, more

Materials Science & Engineering A > 2015 > 625 > Complete > 296-302

Ultra-fine grained materials exhibit outstanding properties and are therefore favorable for prospective applications. One of these promising systems is the composite assembled by the body centered cubic niobium and the face centered cubic copper. Cu–Nb composites show a high hardness and good thermal stability, as well as a high radiation damage tolerance. These properties make the material interesting...

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INFONA - science communication portal

Search results for: Daniel Kiener

Editorial for the Special Issue on the Occasion of Reinhard Pippan's 70th Birthday: Celebrating a Legacy of Innovation and Excellence in Material Science

Editorial for the Special Issue on the Occasion of Reinhard Pippan's 70th Birthday: Celebrating a Legacy of Innovation and Excellence in Material Science

Exploring Refinement Characteristics in FeTi–Cu_x Composites: A Study of Localization and Abrasion Constraints

High‐Throughput Micromechanical Testing Enabled by Optimized Direct Laser Writing

High‐Throughput Micromechanical Testing Enabled by Optimized Direct Laser Writing

Novel Approach for Assessing Cyclic Thermomechanical Behavior of Multilayered Structures

Understanding the effect of surface flaws on the strength distribution of brittle single crystals

In-situ TEM observation of {101¯2} twin-dominated deformation of Mg pillars: Twinning mechanism, size effects and rate dependency

The use of femtosecond laser ablation as a novel tool for rapid micro-mechanical sample preparation

Extraction of Flow Behavior and Hall–Petch Parameters Using a Nanoindentation Multiple Sharp Tip Approach

Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating

Correlative microstructure and topography informed nanoindentation of copper films

Ductilisation of tungsten (W) through cold-rolling: R-curve behaviour

Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

FIB-induced dislocations in Al submicron pillars: Annihilation by thermal annealing and effects on deformation behavior

Fracture and material behavior of thin film composites

Thermally activated deformation processes in body-centered cubic Cr – How microstructure influences strain-rate sensitivity

Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary

Fracture mechanics of thin film systems on the sub-micron scale

Elevated temperature mechanical properties of novel ultra-fine grained Cu–Nb composites

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