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This paper presents a novel die attach material that withstands high working temperature of at least 415 °C after low temperature liquid bonding at 250 °C. The die attach material was preform compressed with Cu@Sn core-shell microparticles, which were produced using an electroless process. When the reflow temperature reached Sn melting point, the outer Sn layer melted and connected the inner Cu cores...
This paper investigates different properties of the TiO2-SiO2-Fe3O4 core-shell nanoparticles encapsulated for 1 times, 2 times, 3 times (which are named as TSF1, TSF2 and TSF3 in this paper). The TSF nanoparticles were obtained through carbon reduction method and sol-gel method. The properties of the TSF1, TSF2 and TSF3 were characterized by Transmission Electron Microscope (TEM), X-ray Diffraction...
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