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With the broad application of dry dedusting of blast furnace gas(BFG), the issue of BFG pipeline corrosion comes up because of chlorine in the BFG. Existing methods in preventing the corrosion, such as spraying alkali or installing corrosion-resistant materials, require a significant amount of investment. This paper conducted a novel thermal analysis of the corrosion mechanism to support the study...
Transient thermoreflectance 2D thermal imaging is rapidly proving to be an effective technique for meeting the thermal analysis challenges inherent with today's advanced high speed integrated circuits. Using near infrared light illumination is particularly suitable for the thermal imaging of flip chip mounted devices and silicon substrate chips. High speed transient imaging reveals the timing of heating...
Cluster-like 4ZnO·B 2 O 3 ·H 2 O nanostructure and 4ZnO·B 2 O 3 ·H 2 O nanoribbon have been prepared under hydrothermal conditions at 120°C for 12h. All the samples were characterized by the X-ray powder diffraction (XRD), infrared spectrum (IR), and energy dispersive X-ray spectroscopy (EDS). The sizes and morphologies of the products were investigated...
A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction...
The effect of yttria on the solid reaction mechanism of a CaHPO4·2H2O + CaCO3 system at different temperatures was experimentally studied. The samples with and without yttria were subjected to thermogravimetric/differential scanning calorimetry measurement. The samples were heat treated at the temperatures corresponding to the peaks on the DSC spectra, and the resulted phase compositions were identified...
The electrical transient testing method has become popular as a useful thermal analysis tool because of its accuracy, high repeatability and rich information content compared to the use of traditional steady state thermal characterization techniques. This paper presents a thermal study of a 16-chip memory module using transient testing. The two variables in this study are the thermal boundary conditions...
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