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The local deformation behavior of the free air ball (FAB) and the heat affected zone (HAZ) of thermosonic wire bond interconnections is of great interest in reliability considerations for current highly integrated microelectronic devices. The mechanical properties of the HAZ have significant influence on the loop stability, which is very critical in fine pitch and long loop applications. On the other...
Heavy aluminum wire bonding is of great interest as a first level packaging technology for automotive and power electronic devices. The related mechanical and thermo-mechanical cyclic loading conditions require an adequate consideration of reliability aspects and lifetime estimations based on in-depth knowledge of material properties, involving an understanding of the correlation between mechanical...
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