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This work studies the potential of using emerging 3D integration to improve embedded VLIW computing system. We focus on the 3D integration of one VLIW processor die with multiple high-capacity DRAM dies. Our proposed memory architecture employs 3D stacking technology to bond one die containing several processing clusters to multiple DRAM dies for a primary memory. The 3D technology also enables wide...
From a system architecture perspective, 3D technology can satisfy the high memory bandwidth demands that future multicore/manycore architectures require. This article presents a 3D DRAM architecture design and the potential for using 3D DRAM stacking for both L2 cache and main memory in 3D multicore architecture.
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