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Future microelectronics will utilize 3D space offering higher performance, high density, and novel features. In article number 1902994, inspired by natural selfassembly processes, Daniil Karnaushenko, Feng Zhu, Oliver G. Schmidt, and co‐workers provide a vision as to how 3D microelectronics should be developed in the near future. History as well as the current state of art are reviewed for microelectronic...
Modern microelectronic systems and their components are essentially 3D devices that have become smaller and lighter in order to improve performance and reduce costs. To maintain this trend, novel materials and technologies are required that provide more structural freedom in 3D over conventional microelectronics, as well as easier parallel fabrication routes while maintaining compatability with existing...
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