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This paper explores the planar arrangement feature of the copper interconnects in a view field of several millimeters by the focused ion-beam (FIB) Moiré inversion method quantitatively. The curved FIB Moiré patterns indicate that the copper interconnects are a series of curves with continuous variations instead of beelines. The control equation set of the copper interconnects central lines is attained...
Based on the combined milling-imaging capabilities of focused ion-beam equipment, a novel approach of measuring residual stress of interconnects by slot milling and geometric phase analysis is presented. This method is performed through measuring the displacement field perpendicular to the slot due to the stress release by geometric phase analysis, and then solving the residual stress along the interconnect...
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