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An efficient electro-thermal simulation based on parallelized alternating-direction-implicit (ADI) method is presented for transient analysis on-chip interconnects. Both temperature-dependence of electrical resistivity and Joule heating effect are taking into account in the modeling. With the ADI technique, the heat conduction equations can be calculated with linear computational complexity. The open...
An efficient transient thermal simulation of 2.5-D integrated system with through silicon via (TSV) interposer is presented by the equivalent thermal model and the alternating-direction-implicit (ADI) method. The equivalent thermal conductivities of TSV interposer and bump layers are extracted properly. The temperature-dependence of thermal conductivity is taking into account in the modeling as well...
An efficient transient thermal simulation of complex integrated system is carried out based on the equivalent thermal model and alternating-direction-implicit (ADI) method. The temperature-dependent leakage power dissipation in chips is taken into account in the modeling. With the ADI technique, the heat conduction equations in the matrix form are solved with linear computational complexity and memory...
An efficient transient electro-thermal simulation of on-chip interconnects under electrostatic discharge (ESD) stress is carried out with the alternating-direction-implicit (ADI) method. Both temperature-dependence of electrical resistivity and Joule heating effect are taking into account in the modeling. With the ADI technique, the heat conduction equations in the matrix form are derived at three...
An improved waveform relaxation (WR) method with joint-diagonalization (JD) preconditioning technique is presented for fast simulation of a large number of cables with strong coupling. In the modeling, the impact of electromagnetic coupling between the cables is reduced effectively by introducing the JD algorithm. Then, the waveform relaxation with transverse partitioning (WR-TP) method is utilized...
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