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A 600V three-phase single chip inverter IC has been developed using a new SOI technology instead of conventional 500V Dielectric Isolation (DI) technology. In this new technology, 600V high voltage devices were materialized with a newly introduced poly-Si field plate and a multi diffusion region in order to reduce the electric field. A new IGBT accomplishes high current density with an on-resistance...
We present a new concept in insulated-gate bipolar transistor (IGBT) gate drivers with a blocking voltage up to 3.3kV that have a pulse transformer interface and a function for self-adjusting active gate control. The error-correcting decoder we proposed contributed to the reliability of signal transmission. Moreover, the method of gate control using differentiation of gate voltage could automatically...
High-performance p-channel lateral double-diffused MOS (LDMOS) transistors designed to operate in a wide voltage range from 35 to 200 V and built using silicon-on-insulator LDMOS platform technology were studied. A novel channel structure was applied, and consequently, a high saturation drain current of 172 in the 200-V p-channel LDMOS transistor was achieved, which is comparable...
A low-resistance and compact MOSFET for analog switch ICs with Dielectric Isolation (DI) process technology is proposed. To obtain a high current density, we have developed new MOSFET with internal prominence, which reduce the drift resistance of devices with a high breakdown voltage. New N-ch and P-ch compact MOSFETs for level shifters have also been developed that can control saturation current...
We have developed high performance Pch-LDMOS transistors in wide range rated voltage from 35V to 200V SOI LDMOS platform technology. By applying a novel channel structure, a high saturation drain current of 172 μA/μm in the 200V Pch-LDMOS transistor was achieved, which is comparable to that of the Nch-LDMOS transistor. A low on-resistance of 3470 mΩ∗ mm2 was obtained while maintaining high on- and...
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