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The industry is going through a transition in material sets for second level interconnects including adoption of leadfree solders. High-rel systems may often have a mix of components with different solder alloys in the printed circuit assemblies including both leaded and leadfree solders because some original leaded components may only be available in leadfree configurations. In this paper, the potential...
Electronic systems may be subjected to prolonged and intermittent periods of storage prior to deployment or usage. Prior studies have shown that leadfree solder interconnects show measurable degradation in the mechanical properties even after brief exposures to high temperature. In this paper, a method has been developed for the determining equivalent storage time to produce identical damage at a...
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