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Pulsed UV laser ablation was explored as a means of removing thin (200 nm) gold films from one side of a transparent, thin (50 μm) quartz substrate. Single-pulse laser ablation (KrF excimer laser, 248 nm) was used to remove a top gold film without damaging the pre-patterned gold electrode deposited on the opposite side of the quartz substrate. Scanning electron microscope images were taken to evaluate...
Pulsed UV laser ablation is used to remove a thin (250nm) gold film from one side of a 130μm thick quartz substrate. This is done without removing the gold film deposited on the bottom of the quartz plate. An excimer laser is used to remove the gold film with single pulse ablation. We further analyze the effects of increasing pulse energies on the bottom film, and show the progression from pinhole...
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