The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The main failure mechanisms of high power diode lasers such as material defects, mirror damage and solder related failures as well as to methods which significantly suppress the occurrence of catastrophic failure and solder related failures are investigated in this paper. Meanwhile, in order to obtain the lifetime data of high power QCM cm-bar arrays, we have set up an automated diode array reliability...
Light-emitting diodes (LEDS) are a strong candidate for the nest-generation general illumination applications. The reliability of LEDs is the key point for its applications, and the main challenges facing the development of high reliable LED is packaging process. In this paper, the overview of state of the art techniques in LED failure analysis is provided, and the main failure modes such as bonding...
The reliability, long-term performance and lifetime of high power diode lasers are important issues for pumping of solid state and fiber laser systems. In order to obtain the lifetime data of high power QCW 808 nm cm-bars, we have set up a computer controlled diode array reliability experiment which can automated monitor the laser arrays 24 hours a day. Using this setup 10 high power QCW cm-bars currently...
We report here the lifetime testing of 10 high power cm-bar arrays using an automated diode array reliability experiment. The devices are tested at 25degC/100A, with a pulse width of 200 mus and a duty factor of 2%. Most devices survive more than 1.0times109 shots. Failure analysis results on the few failing devices reveal failure modes of mechanical stress, chemical contamination and thermal migration.
Package is a key factor, and affects the reliability of LED. In this paper, the main failure modes and mechanisms that caused by poor package process were investigated through some failure analysis cases, and some improving methods to improve the LED's reliability are put forward.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.