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Flexible capacitors have been realized on soft elastic material with the demonstration of good electrical and reliability performance. metal-insulator-metal (MIM) capacitors (~2 pF to ~16 pF) were pre-fabricated by 0.18 ??m Cu-backend technology on Si-substrate and later transferred onto the soft elastic material (polydimethylsiloxane PDMS) by the wafer-transfer technology. After transfer process...
This paper reports burn-in test results of Cu/low-K (BD) interconnects on flexible organic substrate (FR-4,0.1mm) and Si substrate. The electrical yields of via chains (via number: 11,182, via size: 0.26 to 0.5 mum) onto flexible organic substrate remain more than 50% and surviving via chains exhibit average resistance shift of 7.3% which is comparable to Si substrate (6.8%) after 524hrs (388hrs/75degC...
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