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This paper outlines evaporative flow boiling results in custom smooth and internally-grooved tube cold plates with U-bends. Heat transfer data, captured with an infrared camera, is analyzed for liquid-vapor HFE-7100 flow in horizontal 9mm channel diameter cold plates, with mass fluxes from 75–250 kg/m2s, heat fluxes from 0–18 kW/m2, and vapor qualities approaching unity. This data is compared to a...
Embedded cooling — an emerging thermal management paradigm for electronic devices — has motivated further research in compact, high heat flux, cooling solutions. Reliance on phase-change cooling and the associated two-phase flow of dielectric refrigerants allows small fluid flow-rates to absorb large heat loads. Our previous research as well as work of others has shown that dividing chip-scale microchannels...
This paper outlines the development of a physics-based heat transfer coefficient model that recognizes the role played by two-phase flow structures in enhancing two-phase thermal transport within internally-grooved tubes. Flow regime data, obtained with dynamic total-internal-reflection measurements, and heat transfer coefficient data, obtained with infrared thermography, are presented and analyzed...
Forced flow of refrigerants and dielectric liquids, undergoing phase change in a microgap channel above an active chip is a promising candidate for the thermal management of advanced semiconductor devices. This paper presents two-phase heat transfer and pressure drop results for a chip-scale, uniformly heated, microgap channel using HFE-7100 and FC-87 as the working fluids. Results for two channel...
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