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The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in die heat flux and growing concern over the emergence of on-chip “hot spots.” The application of on-chip high heat flux cooling techniques provides a viable direction for the thermal management of such nanoelectronic components. Following a review of the relevant...
Forced flow of refrigerants and dielectric liquids, undergoing phase change in a microgap channel above an active chip is a promising candidate for the thermal management of advanced semiconductor devices. This paper presents two-phase heat transfer and pressure drop results for a chip-scale, uniformly heated, microgap channel using HFE-7100 and FC-87 as the working fluids. Results for two channel...
The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in chip heat flux and growing concern over the emergence of on-chip “hot spots” in microprocessors, along with such high flux regions in power electronic chips and LED’s. Miniaturized thermoelectric coolers (μ-TEC’s) are a most promising cooling technique for the...
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