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Three-dimensional (3D) packaging technology has recently been developed for System in Package applications. The 3D packaging technology with through-hole electrodes has been receiving an especially great deal of attention because through-hole electrodes technology results in compact and high-performance systems. We have developed a new chip-to-chip interconnection method using mechanical caulking...
To verify the operation of three-dimensional SiP with through-hole electrode interconnections, we manufactured a prototype of a 3D-SiP sample composed of a MCU, an interposer, and a synchronous DRAM (SDRAM) chip using a proposed mechanical caulking operation. A new electrode design of LSI for through-hole electrode interconnection is important for establishing a stable mass-production process. By...
The wire bonding technique has been used for conventional 3D-stacked packages. However, it requires an additional bonding area on the substrate and long wires for connecting a chip to a substrate. In this study, a method is described for interconnecting stacked chips using through-hole electrodes. Electrical interconnection between the chips is achieved by simply applying a compressive force at room...
In this study, we proposed the processing of novel Ni powder coated with a major dielectric material BaTiO 3 layer to improve the large sintering shrinkage mismatch between Ni electrode and dielectric materials and the resistance to oxidation of Ni electrode in the co-firing process of multilayer ceramic capacitors (MLCCs). The BaTiO 3 coated Ni powders were successfully synthesized...
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