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In order to extend the performances of integrated circuit (IC), new bonding approaches are being explored. Since copper has good electrical and thermal conductivity, and relatively low cost, it is widely used as the bonding material for advanced packaging. Unfortunately, the normal direct copper-to-copper bonding demands relatively high temperature, which greatly limits its applications. A low temperature...
To realize low temperature thermocompression bonding for 3D packaging and integration is of great significance. This research focuses on Cu-Cu low temperature thermocompression bonding using nanoporous copper films (NPCf) as bonding layer. Cu-Zn alloy as the precursor alloy was fabricated on the ceramic substrate by means of heating-alloy method, then the precursor alloy was immersed into the dilute...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
To realize low temperature thermocompression bonding for 3D packaging and integration is of great significance. This research focuses on Cu-Cu low temperature thermocompression bonding using nanoporous copper films (NPCf) as bonding layer. Cu-Zn alloy as the precursor alloy was fabricated on the ceramic substrate by means of heating-alloy method, then the precursor alloy was immersed into the dilute...
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