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The joint strength and fracture surface of Pb/Sn and Au/Sn solders in laserdiode packages after thermal-aging testing were studied experimentally. Specimens were aged at 150°C for up to 49 days. The joint strength decreased as aging time increased. The microstructure and fracture surface of the Pb/Sn and Au/Sn solder joints showed that the joint strength decrease was caused by both the enlargement...
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