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We here present an approach to cooling of electronics requiring dissipation of extreme heat fluxes exceeding 1 kW/cm2 over ∼1 cm2 areas. The approach applies a combination of heat spreading using laser micromachined diamond heat sinks; evaporation/boiling in fine featured (5 µm) conformal porous copper coatings; microfluidic liquid routing for uniform coolant supply over the surface of the heat sink;...
The stability of electrokinetic flow in a rectangular cross-section microfluidic channel with transverse conductivity gradients and driven by streamwise electric fields was explored. Such a system exhibits a critical electric field above which the flow is highly unstable, resulting in fluctuating velocities and rapid stirring. The problem was studied using theoretical and numerical analyses, as well...
Abstract - High power density GaN HEMT technology can increase the capability of defense electronics systems with the reduction of CSWaP. However, thermal limitations have currently limited the inherent capabilities of this technology where transistor-level power densities that exceed 10 kW/cm2 are electrically feasible. This paper introduces the concept of an evaporative microcooling device utilizing...
Phase separation in two-phase microfluidic exchangers is a promising strategy for reducing the required pumping power. Past research has focused on using hydrophobic nanoporous structures in order to extract water vapor and retain liquid within the vapor-cooling device. This study focuses on characterizing the bursting pressure, the maximum Laplace pressure for liquid containment, of nanoporous alumina...
We report the fabrication and fluid flow characterization of a class of open-cell copper foams known as copper inverse opals (CIOs). This material has finely controlled structure at the pore level, which may enable its use in microscale heat exchangers for microelectronics cooling. We fabricated CIOs by electrodepositing copper around a sacrificial template of packed polystyrene microspheres. We then...
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