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We here present an approach to cooling of electronics requiring dissipation of extreme heat fluxes exceeding 1 kW/cm2 over ∼1 cm2 areas. The approach applies a combination of heat spreading using laser micromachined diamond heat sinks; evaporation/boiling in fine featured (5 µm) conformal porous copper coatings; microfluidic liquid routing for uniform coolant supply over the surface of the heat sink;...
Liquid retention in micron and millimeter scale devices is important for maintaining stable interfaces in various processes including bimolecular separation, phase change heat transfer, and water desalination. There have been several studies of re-entrant geometries, and very few studies on retaining low surface tension liquids such as fluorocarbon-based dielectric liquids. Here, we study retention...
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