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Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on...
Warpage is a critical issue for an electronic package molding process. Much work is done in the past to predict the warpage of a package after the cooling down from the molding process. However, there are many material models for the molding compound to predict warpage: Elastic and viscoelastic models are used, and there are even groups which use cure-dependent viscoelastic models. In this paper,...
Warpage is a critical issue for a QFN panel molding process. Much work is done in the past to predict the warpage of a package during cooling down from molding temperature. However, until now, warpage could not always be predicted well, even if the viscoelastic behavior of the molding compound is taken into account. It was for example observed that the cooling velocity affected the warpage after cooling...
During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die. These residual stresses add up to the stresses generated during thermal cycling and mechanical loading and may eventually lead to product failure. In this paper we focus on three commercial molding compounds and and analyze in detail...
Reliability calculations of the microelectronic packages require cure dependent viscoelastic constitutive relationship for the packaging polymers in order to predict residual stress and strain fields in the final product. The residual stresses can result in the product failure due to warpage, interfacial delamination, thermal fatigue etc. The previous work in the same group (Ernst et al. 2006, 2003)...
Packaging failures has always been the bottleneck of the development on the new techniques of IC packaging using molding compounds. Numerous simulations are developed to minimize the maximum stress during or after the packaging process. Within those simulations, a reliable kinetic model is indispensable since the viscoelastic properties are related strongly with conversion during the cure process...
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