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Dynamic recovery in nanocrystalline Ni and Ni50Fe50 with respective grain sizes of 65 nm and 15 nm is studied using stress reduction tests during in situ X-ray diffraction. The results are compared with a previous study on NC Ni with 35 nm grain size. Defect recovery by means of grain boundary processes plays an important role in controlling the strength evolution resulting in a constant flow stress...
The constant flow stress reached during uniaxial deformation of electrodeposited nanocrystalline Ni reflects a quasi-stationary balance between dislocation slip and grain boundary (GB) accommodation mechanisms. Stress reduction tests allow to suppress dislocation slip and bring recovery mechanisms into the foreground. When combined with in situ X-ray diffraction it can be shown that grain boundary...
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