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More and more dense packaging is one of the most important challenges in advanced electronics and micro technology. One way to achieve this is to bury active as well as passive components into the printed circuit boards. In addition, very short interconnects can be realised which is advantageous especially for RF applications. Besides the pure functionality, the designers of new products have to meet...
Within the framework of the project VERSA, a new approach to beam forming networks is investigated. The aim is to combine structural and electrical functions in one multilayer to gain electrical performance and to save weight. For this purpose a library of standard components for the RF-designer is developed, as well as the fabrication technology to produce these modules reliably and with high yield.
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