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In worldwide semiconductor market has still inflated and required advanced, smaller, and lower cost package. From recently this situation, Fan-Out Wafer Level Package (FOWLP)/Panel Level Package has commercialized to fit for above demands. In this report, our three types of encapsulation materials, i.e., Liquid, Granule/Powder and Sheet encapsulation material, were expressed to apply for FOWLP/Panel...
Semiconductor market has still expanded and required more advanced and smaller package. To meet these requirements, FOWLP and/or Panel Level Package have marketed in recently. In this report, Liquid, Granule and Sheet materials were described as an encapsulation for FOWLP/Panel Level Package. Especially, warpage might be a key issue from the future standpoint for scaling up process and application...
As one approach of advanced packaging technologies, high reliability Liquid Mold UnderFill (Liquid MUF) materials and unique process will be presented here. Liquid MUF materials have the features of high adhesion, low CTE and low modulus. It is possible to alleviate the stress of the solder of each device mounted in the package, and they have excellent reliability too. These materials are adjusted...
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