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Organometal halide perovskite material was investigated as a promising candidate for resistive random-access memory (RRAM). In order to improve the stability of perovskite RRAM, a polymethyl methacrylate (PMMA) interlayer was inserted between perovskite and metal electrode. High ON-OFF current ratio (106) and operating voltage as low as 0.5 V were achieved in the PMMA encapsulated perovskite RRAM.
The existence and interactions of intake vortices and floating debris in diversion system lead to trash rack blocking, vibration and seriously threats the safety of trash rack. Taking Fengman Hydraulic Station as the experimental object, the article discusses the formation and development process of intake vortices, the interactions between vortices and floating debris, the blocking process of floating...
In this paper, a platinum thin film thermal flow sensor was presented. Design, fabrication process and thermal analysis were presented and discussed. Compared with traditional structure of four supporting beams, the present structure can provide high sensitivity and good strength because of the unique thermal and mechanical design. The sizes of the flow sensor chip are 571 μ m × 280 μ m × 0.25 μ m...
This paper reports the experimental and theoretical exploration of the fracture mechanism active in BGA lead-free solder assemblies under high speed shear fatigue test conditions. Our investigation finds that, contrary to common assumption, the crack growth in shear fatigue is not governed by shear stress but more by crack opening stress. Our theoretical analysis indicates that fracture by crack opening...
This study concerns the failure mechanism of a lead-free SAC305 solder joint under the isothermal bending fatigue condition. For this, series of bending fatigue tests are carried out with the variations of bending displacement and frequency, and FEM analysis is conducted to examine the relationship between mechanical behavior of a solder joint and fatigue life cycle. The results of this investigation...
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