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A new extrinsic network and extrinsic parameter extraction methodology is developed for high power RF LDMOS transistor modeling. This new method uses accurate manifold de-embedding using electromagnetic simulation, and optimization of the extrinsic network parameter values over a broad frequency range. The new extrinsic network accommodates feedback effects which are observed in high power transistors...
Constitutive models for SnAgCu solder alloys are of great interest at the present. Commonly, constitutive models that have been successfully used in the past for Sn-Pb solders are used to describe the behavior of SnAgCu solder alloys. Two issues in the modeling of lead-free solders demand careful attention: 1) Lead-free solders show significantly different creep strain evolution with time, stress...
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