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Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder...
Commonly, constitutive models of solder alloys are derived from mechanical tests performed on either bulk solder specimens or on specially assembled BGA test coupons where the stresses are borne by solder ball interconnects. It has been widely recognized that models derived from bulk sample test data may not be reliable when predicting deformation behavior at the solder interconnect level due to the...
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