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Vacuum diffusion bonding of stainless steel to copper was carried out at a temperature ranging from 830 to 950 °C under an axial pressure of 3 MPa for 60 min with three kinds of interlayer metals: tin-bronze (TB) foil, Au foil, and TB-Au composite interlayer. The results showed that the grain boundary wetting was formed within the steel adjacent to the interface due to the contact melting between...
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