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Silver sinter technology is a very promising lead free interconnection method with high operating temperature, high thermal and electrical conductivity. In high power semiconductor modules the die attach material connects the die to the insulating substrate. These die attach materials need to be optimized to provide low electrical resistance and high thermal conductivity. Various silver sinter materials,...
Packaging of power semiconductor modules is facing huge challenges from automotive customers in terms of performance, temperature, reliability, weight, volume and cost etc. It is believed that choice of the power module structure, material and assembly technology are key factors for mitigating the challenges. Among them, the cooling structure and of the module is of most importance to address these...
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