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A programmable multizone thermal-processing module is developed to achieve wafer-temperature uniformity during the thermal-cycling process in lithography. The bake and chill steps are conducted sequentially within the same module without any substrate movement. An array of thermoelectric devices (TEDs) is used to provide a distributed heating to the substrate for uniformity and transient temperature...
Current photoresist processes in advanced lithography system are especially sensitive to temperature. In this manuscript, we proposed an in situ method to control the wafer spatial temperature uniformity during thermal cycling of silicon wafer in the lithography sequence. These thermal steps are usually conducted by the placement of the substrate on the heating or bake-plate for a given period of...
A programmable multizone thermal processing module is developed to achieve temperature uniformity of a silicon wafer during the thermal cycling process in lithography. In the proposed unit, the bake and chill steps are conducted sequentially within the same module without any substrate movement. The unit includes two heating sources. The first is a mica heater which serves as the dominant means for...
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