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The authors present a 3-chip mixed integration approach that combines monolithic silicon multi-terminal power chips and flip-chip assembly on a printed circuit board (PCB) for the realization of a multiphase power converter. The overall approach allows for taking advantage of the degrees of freedom offered by silicon and PCB technologies with a limited and well-mastered complexity. The multiphase...
In this paper, the authors present a novel integration approach for multi-phase IGBT module, based on both monolithic and hybrid integration methods. In this proposed “3-chip” approach, the discrete switches are integrated into three generic monolithic multi-pole power chips and assembled with a judicious packaging. This reduces significantly the commutation loop area and so the stray inductance responsible...
Modern power electronics is focused on highly efficient, compact and cost-effective converters. In this paper, gallium nitride (GaN) transistors, multicell topology and integrated capacitors are combined to achieve these objectives. The first results of a 48V-to-5V DC/DC 3-level converter using integrated screen printed capacitors are presented. The power board is designed by assembling a ceramic...
In this paper, the merits of a high-frequency resonant converter for supplying dielectric barrier discharges (DBD) devices are established. It is shown that, thanks to its high-frequency operating condition, such a converter allows to supply DBD devices with short discharge current pulses, a high repetition rate, and to control the injected power. In addition, such a topology eliminates the matter...
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