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Nowadays, the microelectronics industry broadly uses the flipchip technology to enhance the packaging density. However, the small size and the unique geometry of the flip-chip solder joints induce the electromigration (EM) reliability issue. In this study, a Pb-free solder joints (SAC1205) was EM tested by a current of 7.5×103 A/cm2. During the tests, a three-dimensional (3D) X-ray laminography method...
The traditional active fault detection data is 2D and managed with GIS software. The depth information including in those data is hard to save and present in a 2D map. In this paper, basing on the data produced in the active fault detection project including DEM model and remote sensing image, drill, section, fault, strata, crustal structure, earthquake tomography, Moho depth, and earthquake data,...
During the Underground Construction, the ground surface and the building near the construction site would be impacted and the deformation would occur. The empirical deformation forecast methods, as the simple, useful, and more efficient deformation prediction methods, are widely used in Engineering Investigation. We develop the Underground Construction Deformation Display System (UCDDS) basing on...
A novel system for automatic three-dimensional ink-style rendering is presented. The goal for the whole is to transmit the Chinese painting style to three-dimension models. In this system, the input artwork is first segmented into several regions used for modeling and artistic style analysis: (1) region contours and skeletons is found to build three-dimension models by surface inflation technique,...
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