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GaAs SAINT FETs with a p-layer buried under the active layer have achieved below 10 ps/gate (9.9 ps/gate) operation for the first time in semiconductor devices. The p-layer formed by Be+ implantation is completely depleted by the built-in potential. It has successfully alleviated the short channel effects without increasing parastic capacitance.
A new GaAs MESFET structure with n+-implanted layers and a self-aligned gate has been developed by dielectric lift-off technology with trilevel resist. The electrical characteristics are improved greatly by resistance reduction outside the channel under the gate. 280 mS/mm transconductance and 39.5 ps/gate propagation delay have been obtained.
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