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Self-aligned double patterning (SADP) lithography is a promising technology which can reduce the overlay and print 2D features for sub-32nm process. Yet, how to decompose a layout to minimize the overlay and perform hot spot detection is still an open problem. In this paper, we present an algorithm that can optimally solve the SADP decomposition problem. For a decomposable layout, our algorithm guarantees...
Three dimensional (3D) semiconductor circuit integration has been an active area of research recently. Part of the driving force behind this interest has been applications. In this paper, we identify applications that drive 3D integration and point out the challenges they bring. In particular, we focus on through silicon via-based (TSV-based) 3D integration. TSV-based 3D integration opens up a new...
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