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The influence of the cooling rate and the type of under bump metallization (UBM, i.e., Cu and Ni) on the undercooling and solidification behavior of Sn-Ag-Cu (SAC) based solders (i.e., Sn-1.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu) and their joints was characterized. The results show that the cooling rate has little influence on the undercooling of Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder balls,...
It has been observed that a gas turbine will have an obvious low generation efficiency if the inlet air temperature is high. To address this issue, many gas generators in warm areas are equipped with cooling systems to lower the inlet air temperature and to increase generation efficiency. However, neither the impact of air temperature nor the operation of cooling systems has been analytically investigated...
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