The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this chapter, we review some of the most recent results in these areas and put them in a unified context that covers a very wide range, from materials to system design. The first section presents a top-down silicon nanowire fabrication platform for high-mobility gate-all-around (GAA) MOSFETs and impact-ionization devices. Ferroelectric FET with sub-100-nm copolymer P(VDF-TrFE) gate dielectric are...
In this work, we present the technological constrains and limitations in the design of ultra-thin body Junctionless Vertical Slit Field Effect Transistor (JL VeSFET). A design space that take into account the intrinsic off-current, the sub-threshold swing and the drain induced barrier lowering is investigated with respect to key technological parameters. This work could serve as a guideline for technology...
This paper reports an alternative simple fabrication process for twin gate junctionless Vertical Slit Field Effect Transistors. N-type devices have been successfully manufactured on SOI substrates with a doping density 5×1018 atoms/cm3. The devices demonstrate up to six decades of Ion/Ioff ratio and a sub-threshold swing of 90 mV/decade relative to a slit width of approximately 10 nm.
This paper proposes a CMOS based process for Vertical Slit Field Effect Transistors. The central part of the device, namely, the vertical slit, is defined by using electron beam lithography and silicon dry etching. In order to verify the validity and the reproducibility of the process, devices having the slit width ranging from 16 nm to 400 nm were fabricated, with slit conductance in the range 0...
In this work we report dense arrays of highly doped gate-all-around Si nanowire accumulation-mode nMOS-FETs with sub-5 nm cross-sections. The integration of local stressor technologies (both local oxidation and metal-gate strain) to achieve ≥ 2.5 GPa uniaxial tensile stress is reported for the first time. The deeply scaled Si nanowire shows low-field electron mobility of 332 cm2/V.s at room temperature,...
In this work we report an experimental study on accumulation-mode (AM) gate-all-around (GAA) nMOSFETs based on silicon nanowires with uniaxial tensile strain. Their electrical characteristics are studied from room temperature up to ∼400 K and carrier mobility, flat-band and threshold voltages are extracted and investigated.
Interest in Ferroelectric FETs originates from their potential as non-volatile memories and, more recently, as abrupt switches. In this work, we focus on the role of the Curie temperature of the gate stack on the performance of Fe-FETs. The proposed study is based on thin film SOI Fe-FETs using organic ferroelectric gate stacks (45 nm P(VDF-TrFE) 70%-30% layer on top of 10 nm thermal SiO2). The device...
We report on the fabrication and measurement of triangular gate-all-around (GAA) and tri-gate devices. On the small triangular cross-section devices we observe a significant enhancement of the extracted carrier mobility (up to ~1000cm2/Vs). We assign this effect to enhanced conduction in the sharp corners of our device, and local volume inversion. The new concept of local volume inversion is supported...
This work reports on the fabrication, characterization and modeling of single electron transistor behavior in gate-all-around silicon nanoscale MOS devices. Polysilicon-gated nanowire transistors with triangular cross-sections, ranging from 20 to 250nm are fabricated by an original isotropic etching technique resulting in localized-SOI on bulk-Si wafers. Low temperature (T<20K) characteristics...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.